Description
Chem-Wik Desoldering Braid ensures fast and safe desoldering with ultra-pure, oxygen-free copper braid that quickly and completely removes solder from circuit boards and components. Its fast wicking action protects components from harmful heat damage.
All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.
Features:
- Chem-Wik Rosin 5′ spools packaged in ESD-safe static dissipative bobbins
- Requires little or no post solder cleaning, no corrosive residues
- Optimized weave design for faster wicking and heat transfer
- Halide free
- Coated with ultra high purity, noncorrosive Type R rosin flux
- Quickly and thoroughly removes solder
- Fast wicking action protects components from harmful heat damage
Applications
- Chem-Wik Rosin desoldering braid safely removes solder from:
- Thru-hole Components
- Surface Mount Device Pads
- BGA Pads
- Micro Circuits
- Terminals
- Lugs and Posts
- Identification Script
Specifications
- MIL-F-14256F Type R
- NASA STD-8739.3 Soldered Electrical Connections
- ANSI/IPC J STD-004, Type ROL0
- DOD-STD-883E, Method 2022
Categories: Desoldering Braid (Wick), Chem-Wik
Applications: PCB Repair & Prototyping
Units Per Case: 12 pens
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